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Optimization of laser-based glass frit bonding for optoelectronic packaging using response surface methodology

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成果类型:
期刊论文
作者:
Yin, Jiu;Zhong, Peixin;Chen, Chang;Li, Yuan;Chen, Genyu
通讯作者:
Yin, J
作者机构:
[Li, Yuan; Yin, Jiu; Chen, Chang] Hunan City Univ, Sch Mech & Elect Engn, Yiyang 413000, Peoples R China.
[Zhong, Peixin] Jiangxi Hongdu Aviat Ind Co Ltd, Nanchang 330096, Peoples R China.
[Yin, Jiu; Chen, Chang; Chen, Genyu] Hunan Univ, Coll Mech & Vehicle Engn, Changsha 410082, Peoples R China.
通讯机构:
[Yin, J ] H
Hunan City Univ, Sch Mech & Elect Engn, Yiyang 413000, Peoples R China.
语种:
英文
关键词:
Laser-based glass frit bonding;Response surface methodology;Bonding performance optimization;Optoelectronic packaging
期刊:
OPTICS AND LASER TECHNOLOGY
ISSN:
0030-3992
年:
2025
卷:
181
页码:
111678
基金类别:
CRediT authorship contribution statement Jiu Yin: Writing – original draft, Methodology, acquisition, Data curation, Conceptualization. Peixin Zhong: Validation, Resources, Conceptualization. Chang Chen: Writing – review & editing, Software, Data curation. Yuan Li: Visualization, Software, Data curation. Genyu Chen: Supervision, Project administration.
机构署名:
本校为第一且通讯机构
院系归属:
机械与电气工程学院
摘要:
Laser-based glass frit bonding presents considerable advantages, including fast bonding speed and minimal thermal impact, showing significant application prospects in the packaging of temperature-sensitive optoelectronic devices. In this study, the individual effects of critical process parameters on bonding performance have been investigated through single-factor experiments. Response surface methodology is employed to design experiments systematically for the laser-based glass frit bonding process, focusing on exploring the interactive effect...

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