期刊论文

Grinding Tools with Positive Rake Angle Prepared by Femtosecond Pulsed Laser Machining of Single Crystal Diamond

中文

表面技术

1001-3660

2019

48

2

33-39

10.16490/j.cnki.issn.1001-3660.2019.02.005

国家自然科学基金资助项目（51675172）~~；

本校为其他机构

目的 制造一种磨粒有序排布、具有正前角的无结合剂端面金刚石磨削工具.方法 采用波长为1030 nm、脉宽为250 fs的钛蓝宝石飞秒激光对单晶金刚石(SCD)进行烧蚀加工,首先研究加工工艺参数(特别是烧蚀轨迹间距)对金刚石加工效率及表面质量的影响.采用预先设计的激光扫描路径,基于优化后的工艺参数在SCD表面加工出微磨粒阵列结构,各磨粒呈方锥台形结构,其顶部倾斜角约为100°.在此基础上,对微磨粒阵列进行烧蚀加工,将所有微磨粒顶部的倾斜角减小至小于90°.结果 当激光烧蚀轨迹间距为10.0μm时,烧蚀加工表面RMS粗糙度最小.确定了一种微磨粒边缘倾斜角小于90°且磨粒有序排布的新型无结合剂金刚石端面...

The work aims to fabricate a binder-less diamond face grinding tool with abrasive particles arranged in order and positive rake angle. A Ti: Sapphire femtosecond laser with a wavelength of 1030 nm and a pulse width of 250 fs was used to ablate and process the SCD. The effects of processing parameters, especially the ablation track pitch on the processing efficiency and surface quality of the diamond, were investigated in advance. Based on the optimal processing parameters, an array of square frustum microabrasive with grain inclination angle of...